Specification:CPUIntel® Socket 2066 Core™ X-Series Processors Supports Intel® Virtual RAID on CPU (VROC) * The Intel® Turbo Boost Max Technology 3.0 support depends on the CPU types * Refer to www.asus.com for CPU support listChipsetIntel® X299MemoryIntel® Core™ X-series Processors (6-core above) 8 x DIMM, Max. 128GB, DDR4 4200(O.C.)/4133(O.C.)/4000(O.C.)/3600(O.C.)/2666/2400/2133 MHz Non-ECC, Un-buffered Memory Intel® Core™ X-series Processors (4-core) 4 x DIMM, Max. 64GB, DDR4 4200(O.C.)/4133(O.C.)/4000(O.C.)/3600(O.C.)/2666/2400/2133 MHz Non-ECC, Un-buffered Memory Supports Intel® Extreme Memory Profile (XMP) * Hyper DIMM support is subject to the physical characteristics of individual CPUs. * Actual memory frequency differs from Intel CPU types and memory module. Please check Intel official site for more detail about the memory types supported by each CPU.Multi-GPU SupportSupports NVIDIA® 4-Way SLI™ Technology Supports AMD 4-Way CrossFireX TechnologyPCI Slots7 x PCIe 3.0/2.0 x16 (single x16 or dual x16/x16 or triple x16/x16/x16 or quad x16/x16/x16/x16 or seven x16/x8/x8/x8/x8/x8/x8)StorageIntel® X299 Chipset : 1 x M.2 Socket 3, with M key, type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode) 1 x M.2 Socket 3, with M key, type 2242/2260/2280 storage devices support (PCIE 3.0 x 4 mode) 8 x SATA 6Gb/s port(s) 2 x U.2 connector*1 Support Raid 0, 1, 5, 10 Support Intel® Rapid Storage Technology enterprise 5.1 for X-Series(6-core and above) CPU RAID Supports Intel® Smart Response Technology Intel® Rapid Storage Technology 15 support Intel® Optane™ Memory Ready Intel® Virtual RAID (VROC) support for CPU RAIDUSBIntel® X299 Chipset : 8 x USB 3.1 Gen 1 port(s) (6 at back panel, , 2 at mid-board) Intel® X299 Chipset : 4 x USB 2.0 port(s) (4 at back panel, ) ASMedia® USB 3.1 Gen 2 controller : 2 x USB 3.1 Gen 2 port(s) (2 at back panel, , Type-A + USB Type-CTM) ASMedia® USB 3.1 Gen 2 controller : 1 x USB 3.1 Gen 2 port(s) (1 at mid-board)AudioRealtek® ALC S1220A 7.1-Channel High Definition Audio CODEC – Impedance sense for front and rear headphone outputs – Internal audio Amplifier to enhance the highest quality sound for headphone and speakers – Supports : Jack-detection, Multi-streaming, Front Panel MIC Jack-retasking – High quality 120 dB SNR stereo playback output (Line-out at rear) and 113 dB (Line-in) Audio Feature : – DTS Connect – DTS Headphone:X – Audio amplifier: Provides the highest-quality sound for headphone and speakers – Premium Japanese-made audio capacitors: Provide warm, natural and immersive sound with exceptional clarity and fidelity – Unique de-pop circuit: Reduces start-up popping noise to audio outputs Separate layer for left and right track, ensuring both sound deliver equal qualityLANIntel® I210-AT, 1 x Gigabit LAN Controller(s) Intel® I219-LM , 1 x Gigabit LAN Controller(s)Form FactorCEB Form Factor 12 inch x 10.5 inch ( 30.5 cm x 26.7 cm )WarrantyThree Year Manufacturer Warranty

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